Teledyne FLIR, a division of Teledyne Technologies Incorporated, has unveiled the Teledyne FLIR AVP, an advanced video processor that serves as the backbone for Teledyne FLIR's PrismTM AI and computational imaging capabilities at the edge.
The AVP is built around the Qualcomm QCS8550, which is Qualcomm's latest and most advanced mobile processor chip. Qualcomm is a leader in system-on-chip (SoC) technology for mobile, automotive, and robotics applications. The AVP module offers superior artificial intelligence (AI) performance while being small, lightweight, and power-efficient. It is specifically designed for integrating thermal and visible cameras into various devices such as unmanned aerial vehicles, robots, small gimbals, handheld devices, and fixed-mounted security systems.
The AVP is compatible with Teledyne FLIR's Prism AI and ISP software libraries and supports integration with the Boson® and Neutrino® thermal infrared imaging camera modules, as well as a wide range of popular visible cameras. Prism AI is a robust perception software that leverages deep learning algorithms trained on a vast thermal image dataset containing over 5 million annotations. It is capable of detecting, classifying, and tracking targets or objects in applications such as automotive autonomy, automatic emergency braking, airborne camera systems, counter-drone systems, surveillance and reconnaissance (ISR), and perimeter security. Prism ISP, on the other hand, comprises a comprehensive set of image processing algorithms, including super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local contrast enhancement, and noise reduction.
According to Dan Walker, the Vice President of Product Management at Teledyne FLIR, the AVP stands out as the most powerful and size, weight, and power-optimized (SWaP) processor available today. It delivers AI workloads up to five times faster than competing offerings. The combination of robust edge computing and Teledyne FLIR's Prism digital solutions unlocks new possibilities for electro-optical systems, simplifies development efforts, and reduces integration risks.
The AVP is designed to empower integrators to build high-performance, edge-intelligent products. Teledyne FLIR provides several development tools to facilitate and streamline the integration process, including the Qualcomm RB5 development kit. Additionally, software and board-support packages are available to enable developers to design and fabricate custom interface boards that meet the specific requirements of each product in terms of form, fit, function, and input-output (IO).
